Lewis University Receives Almost $1 Million to Close Skill Gap in Semiconductor Manufacturing
May 03, 2024
May 03, 2024
ROMEOVILLE, Illinois, May 3 (TNSres) -- Lewis University issued the following news release:
The U.S. Congress has finalized Community Project Funding of $950,000 for Lewis University secured by Representative Lauren Underwood (IL-14) in the 2024 appropriations bills. The funding supports innovation in semiconductor manufacturing through research at Lewis University's state-of-the-art semiconductor innovation and workforce development center.
Lewis University facult . . .
The U.S. Congress has finalized Community Project Funding of $950,000 for Lewis University secured by Representative Lauren Underwood (IL-14) in the 2024 appropriations bills. The funding supports innovation in semiconductor manufacturing through research at Lewis University's state-of-the-art semiconductor innovation and workforce development center.
Lewis University facult . . .